Soft-Cover Deposition of Scaling-Up Uniform Solution Processed Thin-Films
Xudong Yang a, Fei Ye a, Jinjin He a, Liyuan Han b
a Shanghai Jiao Tong University, 800 Dongchuan Road, Minhang District, Shanghai, China, Shanghai, 201100, China
b Photovoltaic Materials Unit National Institute for Materials Science
Proceedings of International Conference Asia-Pacific Hybrid and Organic Photovoltaics (AP-HOPV17)
Yokohama-shi, Japan, 2017 February 2nd - 4th
Organizers: Tsutomu Miyasaka and Iván Mora-Seró
Poster, Jinjin He, 118
Publication date: 7th November 2016

Low-cost and high energy conversion efficiency are the crucial factors for large scale application of solar cells. In recent years, a promising high cost-performance photovoltaic technology, organometal halide perovskite solar cells (PSCs), has attracted great attention. However, most of the reported high efficiencies were obtained on a small working area of about 0.1 cm2 with the material utilization ratio of only 1% during film deposition, which actually hinders the advancement in future application of PSCs. Here we present the soft-cover deposition (SCD) method where surface wettability, solution viscosity and thermal crystallization are the processing key factors for the deposition of uniform perovskite films with high material utilization ratios. Scaling-up, pinhole-free, large crystal grains and rough-border-free perovskite films were obtained over a large area of 51 cm2, which were processed continuously in ambient air with a significant enhancement in the material utilization ratio up to ~80%. Unit solar cells fabricated via SCD perovskite films obtained PCEs up to 17.6% in a working area of 1 cm2 with very small hysteresis and high reproducibility. At present, we also applied this unique technology to the deposition of inorganic and organic semiconductor solution processed thin-films which serve as electron and hole transport layers in perovskite solar cell and high performance has been achieved.



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